MALAYSIA – FEBRUARY 28, 2022 – Today Lenovo™ is thrilled to announce an all-new ThinkPad™ X13s developed in collaboration with Qualcomm Technologies, Inc., and Microsoft, as the world’s first laptop powered by the premium Snapdragon® 8cx Gen 3 compute platform1, running up to Windows 11 Pro. The ultra-slim, ultra-light fan-less design delivers the next level of silent always-on, always-connected PC experiences in addition to incredible multi-day battery life rated up to 28 hours2, AI accelerated experiences, enhanced 5G connectivity options including mmWave3, and application support through the Microsoft App Assure program for seamless productivity, security, and collaboration.
Built with 90% certified recycled magnesium in the top and bottom covers, 97% PCC plastic in the battery Printed Circuit Board (PCB) cover and battery frame, and with recyclable carton and bumpers in the packaging4, ThinkPad X13s is designed to consume less energy. Manufactured using Lenovo’s low temperature solder method that can reduce carbon emissions by up to 35%5, the ThinkPad X13s also includes low power 13.3-inch 16:10 display configurations, with touch or Eyesafe® low blue light options. The reduced need for AC power can help reduce energy consumption.
Hybrid workers, global travelers, field technicians, and front-line workers will relish the light 1.06kg (2.35 pounds) laptop, and the virtual elimination of daily power anxiety and connectivity issues as they roam between work-from-anywhere locations. Wi-Fi 6E6 provides a more stable high-speed connection and when unavailable, or a public hotspot is not secure enough, the device can switch to 5G mmWave or sub6 Wireless WAN for lightning fast, highly secure, on-the-go connectivity.
Figure 1: Powered by Snapdragon 8cx Gen 3 compute platform
Technology innovation should be seamless and addressing customer insights for a smarter and more productive collaboration experience is paramount. ThinkPad X13s integrates a communications bar with a 5-megapixel camera with AI-based auto framing plus Infrared (IR) camera option and standard triple-array microphones providing intelligent noise suppression during conference calls. Snapdragon 8cx Gen 3 introduces a Computer Vision processor featuring major user experience improvements, from smarter human presence detection for a more convenient user authentication experience to added security, privacy, and power saving by automatically turning off or dimming the display when the user looks away.
Figure 2:AI Noise Suppression and e-Shutter
The Snapdragon 8cx Gen 3 compute platform delivers exceptional battery efficiency with the performance expected for a premium business laptop. The world’s first 5nm platform for Windows PCs, Snapdragon 8cx Gen 3’s superior architecture makes it Qualcomm Technologies’ most powerful and efficient connected platform. Designed for use in premium, truly mobile PCs, it delivers processing speeds with system-level performance boosts of up to 57% and handles multi-tasking up to 85% faster for incredibly smooth, responsive performance7. Staying always on and always connected is possible with seamless switching between Wi-Fi and ultra-fast 5G mmWave or 5G sub6, or 4G LTE networks. AI accelerated audio and camera capabilities create immersive video conferencing experiences that help users stay productive and engaged.
Delight IT Staff
Hybrid workstyles are here to stay. ThinkPad X13s has the tools to delight end-users, however IT departments need to ensure their endpoint devices meet the strict needs of a diversified business environment. Lenovo Services8 can assist in end-to-end lifecycle needs of the transformation to optimized Modern IT through planning, configuration, deployment, management, support and disposal of assets.
Lenovo, Qualcomm Technologies, and Microsoft continuously collaborate with top tier ISVs (Independent Software Vendors) through the Microsoft App Assure program for Windows on Arm to support native compatibility and enhanced experiences of business-critical applications such as Microsoft 365, Zoom™, Sophos™ and many more that are critical to the productivity and collaboration, device and data security, zero trust network access, and virtualization needs of many enterprise customers. Improved x64 emulation in Windows 11 offers a better experience for legacy applications, allowing software developers to incrementally transition apps to run natively using ARM64EC application binary interface (ABI).
Furthermore, the ThinkPad X13s is equipped with advanced hardware and software threat protection through ThinkShield9 end-to-end security platform, and Snapdragon 8cx Gen 3 integrates layered secure boot and Microsoft Pluton architecture implemented on the Qualcomm® Secure Processing Unit for chip-to-cloud protection of user identity, data and applications on Windows 11 PCs that meet the Secured-core PC standard.
Forging Ahead to a Brighter, more Sustainable Future
In addition to recycled materials and efficient manufacturing processes, Lenovo also offers bulk packaging which can reduce packaging waste. And by enabling businesses to contribute to specific ecological projects through Lenovo’s CO2 Offset Service10, customers have offset more than 500,000 metric tons of carbon dioxide across their purchases of Think PCs (desktops, workstations, laptops). That’s the equivalent of the amount of greenhouse gases emitted from more than 100,000 passenger vehicles driven over the course of one year11.
Figure 3: 90% Recycled Magnesium Material on A and C Covers
“Thanks to our collaboration with Qualcomm Technologies and Microsoft, we are excited to bring a new generation of work-from-anywhere device with the flexibility, mobility and security that enterprise customers need,” said Jerry Paradise, vice president, Global Commercial Product Portfolio, Lenovo PC and Smart Devices. “ThinkPad X13s promises to end power anxiety and delight users with AI accelerated collaboration experiences and hyper-speed connectivity wherever they happen to be.”
“ThinkPad X13s will revolutionize enterprise PCs, built to deliver out of the box security, lightning-fast connectivity, and immersive videoconferencing and collaboration experiences powered by AI technology,” said Miguel Nunes, vice president, product management, Qualcomm Technologies, Inc. “We are proud to work with Lenovo and Microsoft to drive the next generation of enterprise-grade PCs for hybrid work, advancing enterprise experiences that will increase productivity while helping protect and manage their corporate fleet of devices from virtually anywhere.”
“Protection from advanced attacks is a top business priority for today’s hybrid workforce. No matter where work takes place, Windows is designed to offer protection from the chip to the cloud. We are proud to have integrated the Microsoft Pluton security architecture with Snapdragon 8cx Gen 3 compute platform on ThinkPad X13s. This integration will add even more security for identities, data and applications on Windows 11 PCs.” – David Weston, Director of Enterprise and IS Security, Microsoft.
- ThinkPad X13s will be available starting May 2022, starting from €1399.
- In the U.S., the ThinkPad X13s will be available on AT&T, and on Verizon later in 2022. More specific availability and pricing will be shared later.
- More details on local product specifications, availability, recommended retail pricing will be announced at a later date.
|Processor||Snapdragon® 8cx Gen 3 compute platform|
|Operating System||Up to Windows 11 Pro|
|Memory||Up to 32GB LPDDR4x|
|Storage||Up to 1TB PCIe SSD|
|Graphics||Snapdragon® 8cx Gen 3 compute platform with Qualcomm® Adreno™ GPU|
|Display||13.3-inch 16:10-WUXGA IPS 300nit-WUXGA IPS 300nit on-cell touch-WUXGA IPS 400nit, Low Power, Low Blue Light|
|Audio||User-facing Dolby® Audio speaker systemQualcomm® Voice and Audio Communications Suite|
|Camera||-5.0MP camera, optional IR sensor, optional Computer Vision-5.0MP RGB camera|
|Battery||49.5Whr, (video playback up to 28 hours)|
|Security||Qualcomm® Secure Processing Unit with Microsoft Pluton, dTPM, Fingerprint Reader, Windows Hello (IR camera), Camera shutter, Kensington Lock|
|Ports||2 x USB-C 3.2 Gen 2, Audio, SIM|
|Keyboard||ThinkPad TrackPoint keyboard, backlitGlass-like 3-button TrackPad|
|Wireless LAN||Qualcomm® FastConnect™ 6900 SubsystemWi-Fi 6 or Wi-Fi 6EBluetooth® 5.2|
|Wireless WAN||Optional Snapdragon® X55 5G Modem-RF system5G mmWave and sub-6 eSIM and Nano SIM|
|Colors/Materials||Thunder Black, Certified 90% recycled magnesium on A and C covers|
|Dimensions||298.7 x 206.4 x 13.4mm11.76 x 8.13 x 0.53in|
|Weight||1.06kg – 2.35 lbs|